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SMT Assembly

Surface Mount Technology assembly guides and tips

SMT Stencil Design Tips for Reliable Small Batch Assembly

July 13, 2026 by admin

SMT stencil design is critical for small batch PCB assembly. Learn how aperture sizing, stencil thickness, paste selection, and supplier support improve first-pass yield for prototype builds in Hong Kong.

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5 Common SMT Assembly Defects and How to Avoid Them

May 20, 2026May 18, 2026 by admin

Avoid costly SMT assembly defects: solder bridging, tombstoning, voids, misalignment, and cold joints. Expert prevention strategies from FM-TRUE Electronics Hong Kong.

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BGA Assembly: Challenges and Solutions

May 20, 2026May 6, 2026 by admin

BGA assembly presents unique challenges for PCB manufacturers. Learn about X-ray inspection, reflow profiling, and defect prevention. FM-TRUE Electronics delivers zero-defect BGA assembly in Hong Kong.

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Recent Posts

  • Conformal Coating Selection Guide for Harsh Environments
  • PCB Panelization Design Guide for Small Batch Production
  • SMT Stencil Design Tips for Reliable Small Batch Assembly
  • How to Read a PCB Fabrication Drawing
  • Why Impedance Matching Matters for Small Batch PCB Prototypes

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